Copper foil is a thin sheet of copper made through the electrodeposition process or rolling the copper sheet. Compared to aluminum foil, it provides improved flexibility and heat and thermal resistance. As a result, copper foil is widely used as an electric conductor for circuit boards, batteries, and solar energy appliances. It is also utilized in printed circuit boards (PCBs) that are incorporated into telecommunication devices, such as personal computers (PCs), tablets, and mobile phones.
|Base Year: 2021|
|Forecast Year: 2022-2027|
According to the latest report by IMARC Group, titled “Global Copper Foil Market Size, Share, Industry Trends, Growth, Opportunity and Forecast 2022-2027″, The global copper foil market reached a value of US$ 5.24 Billion in 2021. Looking forward, IMARC Group expects the market to reach a value of US$ 8.09 Billion by 2027 exhibiting a CAGR of 7.10% during 2022-2027.
Copper Foil Market Trends and Drivers:
The market is primarily driven by the increasing sales of electronic devices. In addition, the improving 5G infrastructure due to the growing need for better connecting solutions represents another major growth-inducing factor.
Besides this, the market is further propelled by the escalating demand for electric vehicles (EVs) on account of rising greenhouse gas (GHG) emissions worldwide. Moreover, several key players are increasing product differentiation by improving the surface properties of the copper foil and developing new surface treatment coatings to expand their consumer base.
This, coupled with the increasing applications of copper foils in decorative materials, such as monasteries, gold signs, tile mosaic, and handicrafts, are also creating a positive market outlook across the globe.
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Note: We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
Global Copper Foil Market 2022-2027 Analysis and Segmentation:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
Carl Schlenk AG
Chang Chun Group
Furukawa Electric Co. Ltd.
ILJIN Materials Co. Ltd.
JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.)
LS Mtron Co. Ltd.
Mitsui Mining & Smelting Co. Ltd.
Nippon Denkai Ltd.
SKC Co. Ltd.
Sumitomo Metal Mining Co. Ltd.
Targray Technology International Inc.
The report has segmented the market on the basis of region, product type, application and end use industry.
Breakup by Product Type:
- Rolled Copper Foil
- Electrodeposited Copper Foil
Breakup by Application:
- Printed Circuit Boards
- Electromagnetic Shielding
Breakup by End Use Industry:
- Aerospace and Defense
- Building and Construction
- Electrical and Electronics
- Industrial Equipment
Breakup by Region:
- North America: (United States, Canada)
- Asia Pacific: (China, Japan,India, South Korea, Australia, Indonesia, Others)
- Europe: (Germany, France,United Kingdom, Italy, Spain, Russia, Others)
- Latin America: (Brazil, Mexico, Others)
- Middle East and Africa
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Key highlights of the report:
- Market Performance (2016-2021)
- Market Outlook (2022- 2027)
- Porter’s Five Forces Analysis
- Market Drivers and Success Factors
- SWOT Analysis
- Value Chain
- Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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